Portwell Announces Two New Products based on new low-power Intel<sup>®</sup> Atom™ processor:PEB-2736 in the ECX form factor and UMPC-2710 - Portwell, Inc.
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Portwell Announces Two New Products based on new low-power Intel® Atom™ processor:PEB-2736 in the ECX form factor and UMPC-2710

2008-04-03 Taipei,Taiwan RSS Tell a Friend
Portwell Inc., a world-leading innovator in the Industrial PC (IPC) market, announced today the Portwell PEB-2736 utilizing the Intel ECX form factor and the UMPC-2710, both based on the Intel® Atom™ processor Z500 series and the Intel® System Controller Hub US15W. The new micro-architecture of the Intel® platform will provide a range of low power and handheld mobile devices such as Portable POS, Medical Healthcare, Mobile Kiosk, Entry-Gaming, Digital Signage and In-Vehicle Infotainment.

The PEB-2736 is specifically designed to operate at a very low power consumption of less than 10 watts at full loading. It supports dual display by LVDS and the SDVO connector. The modular SDVO and SDIO board architecture is easy for customization to meet customer’s time to market and proprietary requirement.

"We realize the computing power requirement and operation in extreme environment are the keys for in-vehicle infotainment application" says Don Chang, President of Vertical Market Service Business Unit, Portwell, Inc. "The existing micro-power solution in the market can’t support enough computing power. A solution with fanless low power consumption, compact size and versatile IOs for infotainment is what customer needs. PEB-2736 based on the Intel® Atom™ processor can meet the demand of infotainment system."

The PEB-2736 supports one SO-DIMM memory slot for DDR2 SDRAM up to 1GB, and comes with one IDE, one CompactFlash® socket, two RS232, high definition audio CH5.1, six USB2.0 and three SDIO ports. And the PEB-2736 can build-in wireless module via mini-card socket on optional daughter card.

The UMPC-2710 supports multiple I/O interface such as SD/SDIO/MMC/USB. With its peripheral -enriched interface, UMPC-2710 can build-in various sensors and modules therefore suitable for Industry application.

"We realize more and more industry application aspired to deliver their service via mobile device " says Edgar Chang, President of Portwell. The UMPC-2710 based on the Intel® Atom™ processor will support our client into mobile age, explains Edgar.

UMPC-2710 also supports dual display by LVDS internal panel and VGA –Out, and also support SO-DIMM memory slot for DDR2 SDRAM up to 1GB. Moreover, UMPC-2710 build-in Bluetooth 2.0 and WLAN 802.11n

"The Intel® Atom™ processor provides a fanless, compact solution that meets the requirements of the market segments Portwell serves," said Jonathan Luse, director of marketing, Low Power Embedded Products Division, Intel. "The UMPC-2710 will deliver a low power solution for these industrial applications."


Product Link:http://www.portwell.com.tw/products/PEB-2736_ec.html

 

About Portwell

Portwell Inc, an Associate Member of the Intel® Embedded and Communications Alliance, designs and manufactures Network and Security Appliance along with a full range of IPC products (SBC, Backplane, Redundant Power Supply, Rack Mount & Node Chassis), Embedded Architecture Solution and DVR system platform. We provide complete R&D and project management services to decrease customers' time to market, reduce project risk and cost. Portwell is also an ISO 9001 and ISO 14001 certified company which deploy quality assurance through product design, verification and manufacturing cycle.

About the Intel® Embedded and Communications Alliance

The Intel® Embedded and Communications Alliance is a community of communications and embedded developers and solutions providers who share a common vision on the convergence of computing technologies. The member companies within the Alliance are committed to the development of modular, standards based building blocks, platforms, and solutions based on Intel® technologies, processors, products, and services. The availability of these standards-based modular building blocks and solutions offer the market greater choice, faster time to profit, and the opportunity to innovate using modular building blocks from multiple levels of integration - silicon, software, boards and complete systems.

Further Information

More information on this program is available at: http://developer.intel.com/design/network/ica/index.htm

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