4th Generation Computing Solution

6th Generation Intel® Core™ Processor

Skylake for IoT Computing Solutions – OverviewsProducts

6th Generation Intel® Core™ Processor for IoT Computing Solutions – Overview

With the launch of the 6th Generation Intel® Core™ Processor product family (formerly codenamed "Skylake"), Intel® takes performance and computing power to a new level. These new processors combine a new micro architecture with Intel's 14nm process technology, and DDR4 memory support. The product family offers manufacturers a wide selection of processors to build new hardware solutions for an extensive range of applications.

32nm Process Technology
22nm Process Technology
14nm Process Technology
Intel® Microarchitecture (Nehalem)
NEW Intel® Microarchitecture (Sandy Bridge)
Intel® Microarchitecture (Sandy Bridge)
NEW Intel® Microarchitecture (Haswell)
Intel® Microarchitecture (Haswell)
6th generation Intel® Core processor
6th Generation Intel® Core™ Processer Family provides Internet of Things (IoT) computing solution

Portwell's Perspective on Internet of Things (IoT)

The IoT and Industrial 4.0 are exploding. According to Gartner, Inc. (a technology research and advisory corporation), there will be nearly 26 billion devices on the Internet by 2020. In other words, the number of devices or things connected to the Internet is increasing with unstoppable speed. Demand for IoT solutions in Networking, Industrial Automation, Medical, Transportation, and other IoT Industrial 4.0 applications are rising.

As a leader in providing trusted innovative embedded and automation products and solutions, Portwell offers more advanced system, hardware, software, services, and customer-oriented customization support. To meet IoT market demands, Portwell is ready to help customers speed new innovative solutions to market. The picture below shows our position and vision in this global trend.

Deliver intelligence where needed to acquire and filter data securely
Billions of intelligent devices sharing data securely, supporting legacy and new environments
Solutions from device to cloud to deliver end-to-end custormer value

Target Applications

6th Generation Intel® Core™ Processor Comes Up with Performance & New Features

The new 6th Generation Intel® Core™ Processor delivers greater CPU and graphics performance over the previous generation. While offering better performance, the new architecture brings new features like DDR4, DirectX 12, 4K, and PCIe Gen 3 support. The new PCH also brings more I/O ports and flexible high speed I/O combinations. Through the 14nm process technology and other enhancements, Intel® is able to provide up to 30% faster graphic performance with Intel® Gen 9 graphics.

New Features
  • 14nm technology using 2nd generation 3D tri-gate transistors
  • Up to 10% additional CPU performance
  • Intel Rapid Storage Technology for PCle Storage
  • Up to 40% more high speed I/O than prior gen Intel products
  • DDR4 Memory allows customers the flexibility to unify memory routing for ECC enablement in a single board design
  • CSME (FW11) is a Unified firmware for all SKL platforms enabling faster development cycles and debugging capabilities
  • Up to 30% faster graphics performance
  • Up to 3 independent audio streams with video audio
  • Gen 9 Graphics: GT4e for Halo, GT3e for ULT
  • Increased display resolutions supporting Ultra HD 4K x 2K
  • Accelerated HW Media Codecs for Encoding HEVC, VP8, VP9, VDENC
  • HW based security features with Intel® PTT. Boot Guard. lntel MPX
  • SW based security introduces Intel® SGX
  • Intel vPro™ technology support for self encrypting SSDs to protect data automatically
  • Embedded operating systems and support

With flexible high speed I/O combinations, customers have several options of PCH selection to fulfill and meet requirements from different applications. The Gen 3 PCIe support allows faster connection on add-on cards and peripherals. The DDR4 support brings more memory bandwidth which is good for general system performance, but it's especially good for integrated graphics performance. The integrated GPUs are enhanced by Gen 9 technology and DirectX 12.

6th Generatition Intel® Core™ Processor
Next Generation DT Processor with new IA and Graphics Microarchitecture on 14mm process
New CPU Features
  • Increased IA Performance and Faster Graphics @Lower Power
  • Latest: API Support
    • DX 11/12, OGL 4.3/4.4, ES 2.0, OCL 2.x
  • Accelerated HW Media Codecs Support
    • HEVC, VP8, and VP9 Encode
  • High Display Resolution up to 4096x2304
  • 3 lndependent Digital Displays
    • Including embedded DP (eDP)
    • 3 independent Audio Streams
  • DDR4 & DDR3L Memory Support (ECC optional)
  • Intel® Turbo Boost Technology 2.0
  • Intel® Hyper-Threading Technology
  • DMI Gen 3 Support
  • PEG Bi-Furcation (x4, x8, x16)
  • LGA 1151
  • Optimized number of TDP offerings
    • Quad Core: 65W, 35W
    • Dual Core: 65W, 35W
    • Xeon® workstation: 80W
Chipset Compatitibility
  • Intel® 100 Series Chipset
  • Intel® C236 Workstation Chipset
New Chipset I/O Features
  • PCIe Gen 3.0 (up to 20 lanes)
    • PCIe NAND remap (up to 3 devices)
  • USB 3.0 (up to 8)
  • SATA Gen 3.0 (up to 4)
Increased Security
  • Intel® Device Protection Technology with Boot Guard
  • Intel® Memory Protection Extensions
  • Intel® Software Guard Extensions
Embedded Digital Display
DDR3L (1.35V) DDR4 (1.2V)
Digital Display
x16 PCIe Gen 3
DMI Gen 3
PCIe Gen 3
SATA Gen 3/2
USB 3.0
USB 2.0
Intel LAN
Intel® 100
C236 Series Chipset
Enhanced SPI
SM Bus
Desktop - LGA (Haswell + Q87 PCH vs. Skylake + Q100 PCH)
  Line item Haswell DT: 65w, 35w Skylake DT: 65w, 35w Benefits or Key Information
CPU CPU Package LGA1150 LGA1151 New board required
Memory Type/Total System DD3L:1600 (32 GB Max) DDR3L 1600 (32GB Max)
DDR4 2133 (64 GB Max)
• Faster Memory performance
• Long-life for DDR4 designs
• ECC optional
Graphics Generation and
2 (Gen 8)
DX11.1; OCL:1.2, OGL:4.x
2 (Gen 9)
DX11/12, OCL 2x, OGL
4.3/4.4, ES2.0
• Faster graphics for 3D applications, HD video conferencing, and low power media transcode.
  HW Acceleration/Media Codecs Decode for HEVC, VP8, VP9 Decode/Encode for HEVC, VP8, VP9, VDENC
PCH-High Speed I/O PCI Express Lanes Up to 8 PCIe (Gen 2) Up to 20 PCIe (Gen 3) • Flexible I/O with additional high-speed ports over prior generation to enable more flexible designs.
SATA Ports Up to 6 SATA 6.0 Gbps Up to 6 SATA 6.0 Gbps
USB 3.0 Ports
USB 2.0 Ports
Up to 6 ports (2 mixed) 8 ports Up to 10 ports (4 mixed) 14 ports
PCIe NAND Storage Remap
Ports(SATA Express/M.2)
Up to 1 x2 port Up to 3 x4 ports (Gen 3)
Security Security Features Secure Boot, PFAT Intel MPX, Intel SGX, Device Protection with Boot Guard • Hardware and Software features to better protect systems against boot threats, memory overflow issues, and protect data while it's in use in Windows environment.

Ready-To-Go System Solutions

Portwell's wide-range product line gives customer rich choices. Customers can select different form factors from modules (COM Express, Q7, ETX) and embedded boards (ATX, Mini-ITX, Nano-ITX), SBC (PICMG 1.0, PICMG 1.3, Backplane), to systems (Panel PC, Box PC). With Portwell's unique modular design, no matter what kind of solution you're looking for, you can simply start by selecting your preferred platform. Then our complete one-stop service will help you on integration with software (BIOS, EC, embedded OS, BSP, API), hardware (expansion, form factor, peripheral devices, PSU), and system (thermal, chassis). It's simply like playing Lego; just picking up options of bricks then building them up into a system. This easy but quick way will only consume a short period of time on verification and validation. The next step is to meet customer's requirements with our flexibility and customization capability.

Portwell's Solutions based on 6th Generation Intel® Core™ Processor

Portwell uses the new 6th Generation Intel® Core™ Processor to offer five new products in different form factors designed to fulfill requirements from vertical markets. We're proud to announce that the 6th Generation Intel® Core™ Processor is successfully implemented on our COM Express module. With our thermal solution, we're able to use desktop SKUs on PCOM-B637 which help customers on cost reduction. In addition, we also offer PICMG 1.3, ATX and Mini-ITX boards with these new processors.

With our 22-year experience, rich successful projects/use cases, and as a Premier member of the Intel® Internet of Things Solutions Alliance, Portwell is able to bring you state-of-the-art technology and product solutions that help you accelerate time-to-market. Our modular design concept may help you adopt the latest platforms in a shorter period of time. With our flexibility and customization abilities, you can achieve verification and validation without much effort.


Product Model Description

PCOM-B637VG Intel® 6th Core™ processors (Skylake-S) based on Type VI Compact-COM Express2.0 module with DDR4 SDRAM on SO-DIMM slot, VGA, LVDS, Displayport, Gigabit Ethernet, PCIE, SATA and USB

ROBO-8113VG2AR Intel® Xeon® and Core™ i3 processor based on PCIMG 1.3 SHB with DDR4 SDRAM, HDMI, DVI-I, Dual Gigabit Ethernet, Audio and USB

RUBY-D718VG2AR Leading Desktop Intel® 6th Skylake-S processor ATX with DDR4 SDRAM, Triple Displays, Two GbE LAN ports, Six COM Ports

WADE-8017 Leading Desktop Intel® 6th Skylake-S processor Mini-ITX with DDR4 SDRAM, Triple Displays, Two GbE LAN ports, Six COM Ports

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