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MEDM-B603

AMD® Embedded V-series based on TypeVI Compact-COM Express 2.0 module with dual channel DDR4 SO-DIMM slots, DDI Interface, Dual Gigabit Ethernet, PCIe, SATA and USB.
MEDM-B603
 
 
MEDWEL MEDM-B603 is designed with AMD® next generation V-Series SoC solution which leading 3D graphics performance and high-perfromace Zen CPU core for the medical healthcare systems. 


Features
  • COM Express type 6, basic form factor
  • Up to 4 Zen Cores, AMD® Radeon GCN Compute Units
  • Support Dual Channel ECC DDR4 SO-DIMM Horizontal Socket (Up to 16GB)
  • Support Four 4K Displays
  • Support USB 2.0/3.0, SATA, 1 PCIe x16 and 4 PCIex1
  • Next-Generation AMD® Secure Processor

Specifications
Form Factor COM Express Basic Module
Power Input Type COM Express R2.1 Type 6 with +12V and 5VSB DC input
Processor AMD® V-series Great Horned Owl
BIOS AMI BIOS, UEFI Architecture
System Memory Dual Channel ECC DDR4 SO-DIMM Horizontal Socket (Up to 16GB)
Storage Device Support 2x SATAIII
Watchdog Timer Programmable via S/W from 1 sec ~ 255 min
Hareware Monitoring I2C control
Expansion Interface - 1x PCI Express  x8 Interface from SoC chip
- 1x PCI Express  x4 Interface from SoC chip
Audio High Definition Audio Interface
USB - 2x USB 2.0
- 4x USB 3.1
Graphic Controller AMD® Radeon GFX9 with up to 11 compute units
Display Interface - 2x DDI
- Dual Displays Support (DP/eDP/LVDS/HDMI/VGA)
Dimension 125 mm x 95 mm (4.92" x 3.74")
Environment - Operating temperature: 0°C ~ 60°C with passive cooling
- Storage Temperature: -40°C ~ 85°C
- Operation Humidity: 5% ~ 95%, non-condensing
- RoHS compliant
MTBF Over 120,000 hours at 40°C
EMI Certification CE, FCC Class B

Quote & Request Sales Request or Technical Request  
  • Specifications are subject to change without notice.
  • Pentium® 4, Pentium® III, Pentium® II and Celeron® are registered trademarks of Intel® Corporation.
  • Xeon® is a trademark of Intel® Corporation.
  • Other trademarks, logos, brands and company names are the property of their respective owners.
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