模組化電腦

Portwell Technology is dedicated to providing organizations with solutions for all their needs. Whether you require low-power-computing, low-cost computing, or a high-performance computing processor, we have you covered. In fact, all the above requirements are met by the computer-on-modules you’ll find here. Computer-on-modules, also known as COM express modules or COMe or COMe boards, are highly integrated computer boards that feature CPU, memory, – the common I/O of PCIe, SATA, USB, audio, graphics and Ethernet. Portwell’s computer-on-module includes: COM-Expres Extended, COM-Express Basic, COM-Express Compact, COM-Express Mini, QSeven, SMARC, and more.

Browse our selection of COM express boards today, or contact us to identify the best option for your organization’s needs.

Various off-the-shelf core module with additional functionality that is required for specific applications

COM-Express® Mini

COM-Express® Mini: COMe Mini form factor (84 x 55mm) and type 10 pin-out.

Intel® Atom® x6000 series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM
Intel® Atom® E3800 series SoC based on Type 10 Mini COMExpress® module with DDR3L SDRAM, NANDrive and USB 3.0
Intel® Atom® E3900 series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM, NANDrive and USB 3.0

COM Express® Basic

COM Express® Basic (125 x 95mm): COMe basic size form factor (125 x 95mm) and types 6 and 7 pin out.

COM Express Type-VI Basic module with Intel® 11th Gen H Processor (Tiger Lake-H) DDR4 SO-DIMM, DDI, PCIe Gen 4.0, USB 3.2 Gen2x1, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP/LVDS, SATA III and VGA
Intel® Pentium® / Xeon® D-1500 series Processor based on Type 6 COM Express® 2.0 module with DDR4 ECC/Non-ECC 3x SODIMM sockets, VGA, DDI, PCIex 16, USB 3.0, and SATA 6 Gb/s
Intel® Coffee Lake-H Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, Gigabit Ethernet, SATA III, and USB 3.1 Gen2
Intel® Comet Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, VGA, Gigabit Ethernet, SATA III, and USB 3.1 Gen2
Intel® Coffee Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, Gigabit Ethernet, SATA III, and USB 3.1 Gen2
Intel® Xeon® D-1600 series SoC based on Type 7 Basic COM-Express® module
Intel® Pentium® and Xeon® processor D-1500 Series with DDR4 ECC up to 96GB 2400 MT/s on Three SO-DIMM Sockets with 31 PCIe Lanes, 2x KR to support 10G, NC-SI Interface, SATA III, USB 2.0 and 3.0
Intel® Atom® processor C3000 Series with DDR4 ECC up to 96GB 2400 MT/s on Three SO-DIMM Sockets with up to 20 HSIO Lanes, 4x KR to support 10G, NC-SI Interface, SATA III, TPM 2.0, USB 2.0 and 3.0
Intel® Core™ Kaby Lake-H/Skylake-H Processor based on Type VI COM Express ® module with DDR4 SDRAM, VGA, LVDS, Gigabit Ethernet, SATA 3.0 and USB
Intel® 6th Generation Core™ Kaby Lake-S / Skylake-S processors based on Type VI Basic-COM Express® 2.0 module with DDR4 SDRAM on Two SO-DIMM slots, VGA, eDP, DP, Gigabit Ethernet, PCIE, SATA and USB

COM Express® Compact

COM Express® Compact (95 x 95mm): COMe Compact form factor (95 x 95mm) and type 6 pin-out.

Intel® Atom® x6000 series SoC based on Type 6 Compact COM-Express® module with DDR4 SDRAM
Intel® Atom® E3800 series SoC based on Type 6 COM-Express® module with DDR3L 1 x SD-DIMM Socket, VGA, HDMI, DP, eDP, STAT II and USB 3.0
Intel® Atom® E3900 series SoC based on Type 6 COMExpress® module with DDR3L 2 x SD-DIMM Socket, VGA, HDMI, DP, eDP/LVDS, SATAIII, TPM
Intel® Tiger Lake-UP3 Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0, and USB 3.1
Intel® Whiskey Lake-U Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0, and USB 3.1
Intel® Atom® processor C3000 Series with DDR4 ECC up to 64GB 2133 MT/s on Two SO-DIMM Sockets with up to 12 HSIO Lanes, 4x KR to support 10G, NC-SI Interface, SATA III, USB 2.0 and 3.0
Intel® Kaby Lake-U/Skylake-U Core™ i7/i5/i3 processor based on Type VI Compact-COM Express 2.0 module with DDR4 SDRAM on SO-DIMM slots, VGA, LVDS, Display-port, Gigabit Ethernet, PCIe, SATA, USB, and OTG

Qseven Modules

QSeven is derived from "quadratic" as noted by the Q and seven refers to the 7 x 7 cm (70 x 70mm) size of the module.

Automation could be described as an increase in productivity, and/or quality beyond that human labor levels. With the PQ7-C201, the greater PCIe interface enables greater motor control and its UART presence allows for a comport for Legacy components
To save valuable customers’ development time to market, not only the RISC-based boards, but also the following ECO system which Portwell can provide should be taken into consideration: full functions of CPU Module + Carrier board (Q7, Q7+), ready BSP for Android 4.0 & Linux 3.0.x, QT5 & GTK+ Middleware and advanced Utility (Remote Management, Diagnostic Tool) supported
Nowadays automation control system is filled with in various fields, such as Factory Automation, Building Automation, Measurment Equipment.
Qseven Module Based on Intel® Atom™ Processor N3000 Series with DDR3L SDRAM, LVDS/DP and eMMC
Qseven module by Qseven 2.1 based on Intel® Atom® / Pentium® / Celeron processors (Apollo Lake) with LPDDR4 SDRAM up to 8GB, 24bit LVDS, DP/HDMI
Besides original Q7 feature, Q7 Plus function with extra 80-pin enables customers to enhance expansion possibility
More and more places utilize some form of a kiosk, e.g. airports, museums, ATMs, etc. This module comes equipped with a single DVI interface for high resolution. Its D/C input reduces the power use while the Mini PCI Express make upgrades simpler
3.5" ESB Form Factor Carrier Board For Qseven Module
Automation could be described as an increase in productivity, and/or quality beyond that human labor levels. With the PQ7-C200, the greater PCI interface enables greater motor control and its UART presence allows for a comport for Legacy components

SMARC Modules

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. Module sizes are defined: 82mm x 50mm and 82mm x 80mm with 314 edge fingers that mate with a low profile 314 pin 0.5mm pitch right angle connector.

To save valuable customers’ development time to market, not only the RISC-based boards, but also the following ECO system which Portwell can provide should be taken into consideration: full functions of CPU Module + Carrier board (SMARC form factor, “Smart Mobility ARChitecture”), ready BSP for Android 4.0 & Linux 3.0.x, QT5 & GTK+ Middleware and advanced Utility (Remote Management, Diagnostic Tool) supported
SMARC module by SMARC 2.0 based on Intel® Atom™ / Pentium® / Celeron® processors (Apollo Lake) with LPDDR4 SDRAM up to 8GB, 24bit LVDS, DP, HDMI
The pin-out of PSMC-C300ARM is optimized for the features specifically common to ARM® processors. The modular approach allows scalability, fast time to market and upgradability while still maintaining low power and cost performance
To save valuable customers’ development time to market, not only the RISC-based boards, but also the following ECO system which Portwell can provide should be taken into consideration: full functions of CPU Module + Carrier board, ready BSP for Android 4.0 & Linux 3.0.x, QT5, Middleware and advanced Utility (Diagnostic Tool) supported.
PCOM-C605 is Mini-ITX Form Factor Evaluation Carrier Board COM Express Revision 2.0 Type VI Module
PCOM-C615 is PICMG 1.3 Full Size Form Factor Evaluation Carrier Board for COM Express® Revision 2.0 Type VI Module. PCOM-C615 follows standard PICMG 1.3 golden finger pin definition and let customer save system total cost for easily upgrading modules
PCOM-C60B is ATX Form Factor Evaluation Carrier Board for COM Express® Revision 3.0 Type VI Module. PCOM-C60B follows standard COM Express 2.0 carrier board specification
ATX Form Factor Evaluation Carrier Board for COM Express Revision 3.0 Type VII Module with 4x 10GbE Support with Inphi CS4227 PHY
ATX Form Factor Evaluation Carrier Board for COM Expr ess Revision 3.0 Type VII Module with 4x 10GbE Support with Inphi CS4223 PHY
Development of resource-saving technologies which are used in the today's production dictates a necessity to use instrumentation, which would provide a reliable real-time estimate of technical condition of operating equipment.
The demand for using renewable energy is constantly growing and wind energy is an increasingly popular choice. With Portwell modules and PCOM-C600 carrier boards for industrial PCs, Portwell modules offer a powerful and reliable control solution that is now being used by suppliers of wind turbines.
PCOM-C640 is NANO-ITX carrier board with triple display, Gigabit Ethernet, Audio, USB 3.0, SATA. It's a powerful carrier which is suitable for system.
PCOM-C609 carrier offers powerful and reliable solution to customer who has demand of high speed 10 Gigabit Ethernet. It is the first carrier with 10 Gigabit Ethernet with carrier board design guide which can be provided to customerMicro-ATX Form Factor Evaluation Carrier Board for COM Express® Rev 2.1 Type VI Module.

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