Page 9 - Ver. 215S_All
P. 9
Quality Assurance
1 Design & Analysis
Portwell WEBS systems undergo quality assurance procedures during the critical early stages of development.
Designing a stable product makes it easy for quality checking and complies with Design for Quality (DFQ).
At the development stage the product design also involves the material and assembly important for production,
with the focus on Design for Manufacturability (DFM). This develops simple, consistent and eficient system
structures and endows the product with a stable quality.
With their experienced engineering team and complete 3D circuit and layout development facility, Portwell is able
to supply more eficient system development and support their customers in "Design Win."
Design & analysis is performed by 3D workstation. (WEBS-2120) Circuit design & layout by advanced tools (NANO-8044)
2 Thermal Design
Thermal Design Concept
Thermal control is the key to all future industrial appliances. Portwell knows this and has focused many hours of
research and put immense efforts upon thermal solutions.
Based on our indings and experience, many components on the motherboard demonstrated wide temperature
changes which affected the operating temperature endurance of the board and the system.
The CPU T-junction temperature, for example, will dramatically increase around 30 to 40 degrees Celsius from
power-on to full loading under ambient temperature. This means the CPU T-junction could reach between 90
and 100 degrees Celsius when the ambient temperature is at 60 degrees Celsius. Moreover, the CPU T-junction
temperature is capable of an additional 5 degrees Celsius, which exceeds CPU speciications, due to its fan-free
chassis.
In our labs, we saw these symptoms and developed unique solutions. Thermal design and component placement
on a motherboard go hand in hand. Therefore, heat ventilation in a chasis is necessary for fan-less or fan-free
systems.
Some manufactures will claim they have solved the heat dissipation problem based on their calculations and
data sets, but "seeing is believing!" So test your systems in our certiied and advanced labs and see if your
systems meet your speciications.
Since there is no fan and airlow inside the fan-less WEBS systems, handling the thermal output becomes one of
the most important concerns. System heat comes from ICs on the embedded board and this is pre-determined
by Intel . Therefore, the key to developing a reliable fan-less system is determined by two major factors.
®
First is to balance the heat on the embedded board and make sure it does not accumulate. Determining the
thermal balance for the hot components is a prime concern. The picture below shows the heat situation of the
NANO-8044, NANO-ITX embedded board used in the WEBS-2120 system. The heat in this example is arranged
and balanced for superior dissipation in a fan-less system design.
FLIR Systems 60.5 °C
60
Ar1
50
Ar2
40
30
28.1
NANO-8044 M/B Thermal image of NANO-8044 M/B
Quility Assurance 8
1 Design & Analysis
Portwell WEBS systems undergo quality assurance procedures during the critical early stages of development.
Designing a stable product makes it easy for quality checking and complies with Design for Quality (DFQ).
At the development stage the product design also involves the material and assembly important for production,
with the focus on Design for Manufacturability (DFM). This develops simple, consistent and eficient system
structures and endows the product with a stable quality.
With their experienced engineering team and complete 3D circuit and layout development facility, Portwell is able
to supply more eficient system development and support their customers in "Design Win."
Design & analysis is performed by 3D workstation. (WEBS-2120) Circuit design & layout by advanced tools (NANO-8044)
2 Thermal Design
Thermal Design Concept
Thermal control is the key to all future industrial appliances. Portwell knows this and has focused many hours of
research and put immense efforts upon thermal solutions.
Based on our indings and experience, many components on the motherboard demonstrated wide temperature
changes which affected the operating temperature endurance of the board and the system.
The CPU T-junction temperature, for example, will dramatically increase around 30 to 40 degrees Celsius from
power-on to full loading under ambient temperature. This means the CPU T-junction could reach between 90
and 100 degrees Celsius when the ambient temperature is at 60 degrees Celsius. Moreover, the CPU T-junction
temperature is capable of an additional 5 degrees Celsius, which exceeds CPU speciications, due to its fan-free
chassis.
In our labs, we saw these symptoms and developed unique solutions. Thermal design and component placement
on a motherboard go hand in hand. Therefore, heat ventilation in a chasis is necessary for fan-less or fan-free
systems.
Some manufactures will claim they have solved the heat dissipation problem based on their calculations and
data sets, but "seeing is believing!" So test your systems in our certiied and advanced labs and see if your
systems meet your speciications.
Since there is no fan and airlow inside the fan-less WEBS systems, handling the thermal output becomes one of
the most important concerns. System heat comes from ICs on the embedded board and this is pre-determined
by Intel . Therefore, the key to developing a reliable fan-less system is determined by two major factors.
®
First is to balance the heat on the embedded board and make sure it does not accumulate. Determining the
thermal balance for the hot components is a prime concern. The picture below shows the heat situation of the
NANO-8044, NANO-ITX embedded board used in the WEBS-2120 system. The heat in this example is arranged
and balanced for superior dissipation in a fan-less system design.
FLIR Systems 60.5 °C
60
Ar1
50
Ar2
40
30
28.1
NANO-8044 M/B Thermal image of NANO-8044 M/B
Quility Assurance 8
