A rugged, compact embedded system powered by Intel® Amston Lake processors with rich I/O and wireless expansion. Supports up to 32GB LPDDR5 memory, dual 2.5GbE, and TPM 2.0 security, ideal for industrial automation, edge computing, and AI inference at the edge.
| System | |
|---|---|
| CPU | Intel Amston Lake X7213RE, 2 cores, TDP 9W Intel Amston Lake X7433RE, 4 cores, TDP 9W |
| System Memory | LPDDR5 4800 MT/s Non-ECC Memory chips up to 32GB (default: 8GB) |
| Storage | 1 x M.2 M key 2242 socket (For M.2 2242 M key SATA SSD) On board eMMC up to 256GB (default: 128GB) |
| Power Input | DC 12V~30V |
| Operating System | Windows 10 / Windows 11 / Linux |
| TPM | TPM2.0 |
| Expansion | 1 x M.2 E Key 2230 socket (For M.2 WiFi module) 1 x M.2 B Key 3042/3052 socket with dual Micro SIM socket For M.2 4G/5G cellular module, Hailo-8 AI Accelerator module is adopted |
| Basic I/O Interface | |
|---|---|
| Power Connector | 1 x 2-Pin Terminal Block |
| Ethernet | 2 x Intel® I226IT 2.5Gb ports |
| USB | 2 x USB 3.2 Gen 1×1 ports 1 x USB Type C Gen 2×1 |
| Display | 1 x HDMI® 1.4a port 1 x USB Type C port with DP ALT mode |
| Extended I/O Interface | |
|---|---|
| COM / Console | 2 x RS-232/RS-422/RS-485 |
| Certificate | |
|---|---|
| CE, FCC Class A, EN62368-1 |
| Environment & Mechanical | |
|---|---|
| Storage Temperature | -40°C ~ 85°C |
| Operating Temperature | -40°C ~ 70°C |
| Permissible Humidity | 40°C, 95% RH, non-condensing |
| Operation Vibration | 5Grms/10~500Hz, IEC 60068-2-6 |
| Operation Shock | 50G, 11msec, IEC 60068-2-27 |
| Degree of Protection | IP30 |
| Dimension | 120mm(W) x 74mm(H) x 120mm(D) |
| Weight | 1 KG |
| Mounting | Wall mounting / DIN Rail mounting |
| Optional Accessories | |
|---|---|
| Power Adaptor | 2-pin terminal block connector to DC jack cable 60W AC to DC Power Adaptor via DC jack |