As edge architecture evolves, COM-HPC embedded modules provide a standardized next-generation platform for server-class computing. Utilizing a dual-board concept similar to COM Express, this open PICMG® specification increases connectors from 440 to 800 pins to support extensive expansions. It significantly improves I/O interface speeds, supporting PCIe Gen 4/Gen 5 (32GT/s), USB 3.2 Gen 2×2 (20Gbps), USB 4 (40Gbps), and 25G KR signals.
This high-performance computer-on-module standard defines two specialized types:
Featuring support for advanced CPUs with a TDP up to 150W, these rugged modular embedded platforms ensure scalability and maximum performance for mission-critical server applications.
COM-HPC carrier boards deliver scalable, high-performance solutions for embedded computing.
Feature | COM-HPC Server | COM-HPC Client |
|---|---|---|
Size | D, E | A, B, C |
PCIe | 64 + 1(BMC) | 48 + 1 (BMC) |
MIPI-CSI | 0 | 2 |
Ethernet KR (Max. 25G) | 8 | 2
|
NBASE-T (Max. 10G) | 1 | 2 |
USB 2.0 | 8 | 8 |
*USB 3.2 | *2 | *4 |
*USB 4 | *2 | *4 |
DDI, eDP/MIPI-DSI | 0 | 3, 1 |
Soundwire, I2S | 0 | 2, 1 |
SATA | 2 | 2 |
eSPI, SPI | 1, 2 | 1, 2 |
SMB, I²C, IPMB | 1, 2, 1 | 1, 2, 1 |
UART | 2 | 2 |
GPIO | 12 | 12 |
*Note: All USB 3.2 and USB4 options are “upgrade” options: A USB 3.2 instance uses up a COM-HPC USB 2.0 port. A USB4 instance needs to use a USB 3.2 Gen 2×2 port (which in turn uses up a USB 2.0 port).
