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COM Express ®

Standardized Computer-on-Module Platform

COM Express® defines standardized form factors and pinouts for Computer-on-Modules. Each module integrates core computing functions such as the processor, memory, graphics, storage interfaces, and high-speed connectivity, while a carrier board provides application-specific I/O and system expansion.

COM Express is available in three standardized form factors:

  • Mini: 84 × 55 mm
  • Compact: 95 × 95 mm
  • Basic: 125 × 95 mm
COM Express Type 6 Compact Size Module with AMD Ryzen™ Embedded 8000 Processor, DDR5 SO-DIMM, DDI, eDP, LVDS, VGA, PCIe Gen 4, USB 3.2 Gen2, discrete TPM 2.0, SATA, Out-of-Band (OOB) Management
Portwell PCOM-C60F support the COM Express type6 module Basic and Compact Sizes with ATX size(305x244mm) form factor. This carrier board passed the most of Portwell evaluation testing. These functions include but are not limited to a rich complement of high speed interfaces such as PCIe, USB4, SATA. And also support several legacy I/O such as UART, GPIO, SMBUS, I2 C.
Intel®PTL-H; 4P+8E+4LPE; 12Xe GPU (120 TOPS), NPU 5 (50 TOPS); 2x DDR5 SO-DIMM to 128GB IBECC; 12 PCIe Gen4 lanes; USB3.2, SATA, DDI, eDP/LVDS; MIPI-CSI
COM Express® Type6 Compact size module with Intel Atom® x7000E/RE Series SoC DDR5 SO-DIMM, DDI, PCIe Gen 3, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
Intel Atom® x7000 series SoC based on Type 10 mini COM-Express® module with LPDDR5 SDRAM
Intel Atom® C3000/C3000-Refresh series SoC based on Type 7 Compact COM-Express® module with up to Dual Channels and 2x DDR4 ECC SO-DIMM Socket
COM Express Type 6 Basic size module with Intel®New Gen Core Ultra 200 Series Processor DDR5 SO-DIMM, DDI, PCIe Gen 4,USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type6 Compact size module with Intel®13th Gen P/U Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM-Express® Type 7 Basic module with AMD® Embedded RyzenTM V3000 CPU Family equipped on-module NVME SSD
COM Express Type 7 Basic Module based on Intel®Xeon® D-1700 Processors with Three Channels and Four SO-DIMM slots
COM Express Type6 Basic size module with Intel®13th Gen H Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen2, 2.5Gb Ethernet, discrete TPM 2.0, eDP, SATA
Mini-ITX size carrier board for COM Express Type6 module  
Micro-ATX Form Factor Evaluation Carrier Board For Type 10 COM Express@ Rev 3.0 Module
COM Express Type 7 Basic module with Intel®Xeon® D-1700 series Processor (Ice-Lake-D LCC)
COM Express Type-VI Basic module with Intel®11th Gen H Processor with DDR4 SO-DIMM, DDI, PCIe Gen 4.0, USB 3.2 Gen2x1, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP/LVDS, SATA III and VGA
Intel Atom® x6000 series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM

Flexible and Scalable Embedded Computing

By separating the computing module from the carrier board, COM Express enables developers to reuse validated carrier designs across different processor platforms and product generations. This modular approach helps shorten development cycles, simplify system upgrades, and extend product lifecycles.

Portwell COM Express Solutions

Portwell offers COM Express Type 6, Type 7, and Type 10 modules, along with evaluation and application-ready carrier boards. Depending on the selected model, available features may include Intel®or AMD processors, DDR5 memory, PCI Express, USB, SATA, multiple display interfaces, high-speed Ethernet, TPM 2.0, and embedded AI acceleration.

Portwell COM Express solutions are suitable for industrial automation, machine vision, edge AI, medical equipment, transportation, networking, and other embedded applications requiring scalable performance and long-term availability.