As edge architecture evolves, COM-HPC embedded modules provide a standardized next-generation platform for server-class computing. Utilizing a dual-board concept similar to COM Express, this open PICMG® specification increases connectors from 440 to 800 pins to support extensive expansions. It significantly improves I/O interface speeds, supporting PCIe Gen 4/Gen 5 (32GT/s), USB 3.2 Gen 2×2 (20Gbps), USB 4 (40Gbps), and 25G KR signals.
This high-performance computer-on-module standard defines two specialized types:
Featuring support for advanced CPUs with a TDP up to 150W, these rugged modular embedded platforms ensure scalability and maximum performance for mission-critical server applications.
COM-HPC carrier boards deliver scalable, high-performance solutions for embedded computing.
*Note: All USB 3.2 and USB4 options are “upgrade” options: A USB 3.2 instance uses up a COM-HPC USB 2.0 port. A USB4 instance needs to use a USB 3.2 Gen 2×2 port (which in turn uses up a USB 2.0 port).
COM-HPC enables system developers to scale processing performance, memory capacity, networking, and expansion capabilities while retaining an application-specific carrier board architecture. This modular approach helps reduce platform redesign effort, accelerate system development, and provide greater flexibility when upgrading processors or adapting the system to future workload requirements.
COM-HPC Client is suited to applications requiring high-performance processors, advanced graphics, multiple displays, and comprehensive high-speed I/O. COM-HPC Server is designed for headless systems that prioritize multi-core processing, large memory capacity, PCI Express expansion, and high network throughput. Portwell carrier boards support module evaluation, software validation, prototyping, and the transition to customized system designs.
Portwell COM-HPC solutions are suitable for edge AI, machine vision, industrial automation, medical imaging, autonomous systems, telecommunications, network security, edge servers, and other data-intensive applications. By combining standardized modules with application-specific carrier boards, developers can build high-performance embedded platforms tailored to their required I/O, power, thermal, mechanical, and lifecycle specifications.
