eATX size(305x330mm) form factor evaluation carrier board for COM-HPC Sever module
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COM-HPC is a high-performance expansion card for servers. It uses the same concept as COM Express but increases the connectors from 440 pins to 800 pins to support more expansions and improves the speed of the I/O interface with PCIe Gen 4 or Gen 5 (32GT/s), USB 3.2 Gen 2×2 (20Gbps) or USB 4 (40Gbps), and 25G KR signals. COM-HPC has two module types: Server and Client.
COM-HPC is the perfect choice for server applications. It provides up to 65 PCIe and 8 KR Ethernet lanes, making it ideal for connecting servers and other devices. And it also features a CPU with a TDP of up to 150W, so you can get the performance you need.
eATX size(305x330mm) form factor evaluation carrier board for COM-HPC Sever module
COM-HPC Server, Size E Module with Intel® Xeon® D-2700 and D-2800 Server-Class processors support 8 DIMM slots and 2.5GbE Base-T
COM-HPC® Client module Size C module with Intel® 13th/14th Gen socket type processor (Code Name: Raptor Lake-S Refresh) DDR5 SO-DIMM, DDI, PCIe Gen 5, USB 3.2 Gen2, 2.5G Ethernet, discrete TPM 2.0, eDP, SATA
COM-HPC® Client module Size B module with Intel® 12th / 13th Gen H/P/U Series Processor DDR5 SO-DIMM, DDI, PCIe Gen 5, USB4, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA III
Intel® Comet Lake-S Core™ Processor based on COM-HPC® Client module Size C with dual DDR4 SO-DIMM, DDI, eDP, Dual 2.5 Gigabit Ethernet, SATA III, and USB 3.2
