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Mission-Critical Rugged Computing with COM Express

Solution:Aerospace & Defense

Region :Europe

Edge Processing for Mission-Critical Operations

Mission-critical systems often operate in mobile or remote environments, where compact hardware must process multiple video streams and map data. As an edge node in a sensor-to-decision architecture, the system processes imagery and consolidates information close to the source. This shortens the data path and keeps essential functions available when network connectivity becomes unstable. A modular architecture also helps clients work within mechanical and thermal constraints while adapting interfaces for each deployment and preserving a practical upgrade path.

PCOM-B658VGL Integrates Compute, Graphics, and High-Speed Expansion

Built in the 125 x 95 mm COM Express Type 6 Basic Size form factor, the PCOM-B658VGL separates core computing from application-specific I/O. The module handles primary workloads, while a compatible carrier board provides the interfaces required by each project. This approach reduces the need to redesign a complete motherboard. Industrial SKUs support operation from -40°C to 85°C, helping systems start in extreme cold and remain operational under sustained high-temperature conditions.

High-Performance Computing for On-Site Image Processing

13th Gen Intel®Core™ H-series processors support video streaming and concurrent data processing. Integrated Intel®Graphics drives the mission display, allowing operators to review live imagery and map data while monitoring sensor status.

PCIe Gen4 Expansion for Application-Specific Interfaces

PCIe Gen4 enables a compatible carrier board to integrate a video capture card. Applications that require local AI inference can add a suitable accelerator after evaluating carrier-board routing, power limits, and software compatibility. Clients can scale the system around the actual workload without rebuilding the computing core.

Flexible I/O for Data Acquisition and Local Storage

Four USB 3.2 Gen2 ports can connect industrial cameras or external sensors through the carrier board. Two SATA III interfaces and an optional onboard NVMe SSD provide local storage. With NVMe capacity available up to 1TB, the system can retain captured imagery and mission records near the point of operation.

Display and Network Interfaces for Operational Coordination

Carrier-board designs can route DDI, eDP/LVDS, or VGA to a mission display, giving operators direct access to field information. The 2.5GbE interface exchanges data with backend platforms. Industrial SKUs also support TSN/TCC for system communications with timing requirements.

Portwell combines a comprehensive COM Express portfolio with Design and Manufacturing Service (DMS) expertise to help clients integrate computing modules into mission-critical systems. Project-specific carrier-board design and system validation support can shorten product introduction while preserving flexibility for future platform upgrades.

Product Recommendations

  • 13th Gen Intel®Core™ H Series processors in Intel®7 lithography
  • Up to 6x performance core +8x efficient core, and up to 96x graphic execution units
  • 2x DDR5-5200 non-ECC SO-DIMMs up to 96GB, 1x PCIe Gen4 x8(H series), 2x Gen4 x4
  • Options for Industrial Temperature Range -40°C up to +85°C Options for onboard PCIe NVMe SSD

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