Embedded Edge Control Platform for Maritime Autonomy
Discover Portwell’s embedded edge control platforms. Our SMARC modules deliver scalable, low-power computing for maritime autonomy, USVs, and MASS operations.
July 22, 2026
Portwell provides high-reliability defense embedded computing solution designs and aerospace embedded systems through Design and Manufacturing Services (DMS). In addition, we deliver scalable hardware tailored for mission-critical aerospace and defense systems.
Additionally, our scalable computer-on-module platforms support sensor processing, mission communications, and embedded control. As a result, they deliver reliable performance across airborne, land, and maritime environments.
Multi-source sensor integration, signal and image processing, and mission data handling
High-speed networking, data routing, and system communication
Mission-specific I/O, device connectivity, and carrier board integration
Compact, long-life onboard computing for unmanned and maritime systems
Scalable platforms for computing performance, I/O expansion, power, thermal requirements, and future platform migration.
We customize carrier boards to integrate application-specific I/O, connectors, and power systems efficiently.
BIOS, firmware, embedded controller configuration, and system-level integration support based on project requirements.
Long-life availability, BOM control, and EOL planning reduce redesign and requalification efforts.
Engineered for mission-critical reliability, Portwell’s embedded computing platforms integrate rugged design enhancements. As a result, they help system integrators meet challenging environmental requirements and streamline system-level compliance based on MIL-STD specifications and standards:
Wide Operating Temperature (-40°C to 85°C): Industrial-grade component selection ensures stable continuous operation across extreme high- and low-temperature environments. (Featured models: PCOM-B705GT, PCOM-B65F)
Anti-Vibration Onboard Memory Design: Soldered memory configurations eliminate socket-related connection risks under severe shock and high-vibration conditions. (Featured models: PCOM-BC00, PCOM-BA03)
Optional Conformal Coating: Protective PCB coating shields electronic components against moisture, humidity, dust, and environmental corrosion.
Dedicated Thermal Heat Spreader Solutions: Standardized conduction-cooling interfaces enable efficient heat dissipation within sealed, fanless chassis designs. (Featured COM Express modules: PCOM-B707GT, PCOM-B65A)
Discover Portwell’s embedded edge control platforms. Our SMARC modules deliver scalable, low-power computing for maritime autonomy, USVs, and MASS operations.
Find out how COM Express Type 7 drives high-performance systems for comprehensive anti-drone solutions in extreme environments.
Explore Portwell’s full line of industrial computer-on-modules engineered to strict PICMG standards. Specifically, from high-speed COM Express Type 6 and Type 7 to compact Type 10 and SMARC modules, our modular platforms deliver scalable processing power, low-latency connectivity, and long-term availability for demanding defense and aerospace applications.
Intel®New Gen Core™ ultra; 2x DDR5 SO-DIMM to 128GB IBECC; 20 PCIe Gen4 lanes; 4x USB 3.2 Gen2; 2x DDI, eDP
COM Express Type 6 Compact Size Module with AMD Ryzen™ Embedded 8000 Processor, DDR5 SO-DIMM, DDI, eDP, LVDS, VGA, PCIe Gen 4, USB 3.2 Gen2, discrete TPM 2.0, SATA, Out-of-Band (OOB) Management
Intel®PTL-H; 4P+8E+4LPE; 12Xe GPU (120 TOPS), NPU 5 (50 TOPS); 2x DDR5 SO-DIMM to 128GB IBECC; 12 PCIe Gen4 lanes; USB3.2, SATA, DDI, eDP/LVDS; MIPI-CSI
COM Express Type 6 Basic size module with Intel®New Gen Core Ultra 200 Series Processor DDR5 SO-DIMM, DDI, PCIe Gen 4,USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type6 Basic size module with Intel®13th Gen H Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen2, 2.5Gb Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type-VI Basic module with Intel®11th Gen H Processor with DDR4 SO-DIMM, DDI, PCIe Gen 4.0, USB 3.2 Gen2x1, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP/LVDS, SATA III and VGA
COM Express Type 7 Basic Module based on Intel®Xeon® D-1800 Processors with Two Channels and Two SO-DIMM slots.
COM-Express® Type 7 Basic module with AMD® Embedded RyzenTM V3000 CPU Family equipped on-module NVME SSD
COM Express Type 7 Basic Module based on Intel®Xeon® D-1700 Processors with Three Channels and Four SO-DIMM slots
SMARC 2.2 Compliant module (82 x 50 mm) powered by Intel®Alder Lake-N, Amston Lake (Atom® x7000RE), and Twin Lake (Core Processor N) Series SoCs, featuring onboard LPDDR5 SDRAM
Intel Atom® x7000 series SoC based on Type 10 mini
COM-Express® module with LPDDR5 SDRAM
ATX COM Express Type 6 carrier board featuring USB4, PCIe Gen4, and -40°C to 85°C wide-temp support.
Micro-ATX Form Factor Evaluation Carrier Board For Type 10 COM Express@ Rev 3.0 Module
Portwell’s DMS (Design & Manufacturing Services) optimizes precision engineering and innovative design. We transform concepts into leading-edge products with a meticulous approach to customization, ensuring excellence from blueprint to execution. Partner with us to shape the future of industrial technology.
