Intel^® New Gen Core™ ultra; 2x DDR5 SO-DIMM to 128GB IBECC; 20 PCIe Gen4 lanes; 4x USB 3.2 Gen2; 3x DDI, eDP/LVDS

COM Express Type6 Compact size module with AMD Ryzen Embedded 8000 Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen2, discrete TPM 2.0, eDP, SATA, Out-of-Band(OOB)

Portwell PCOM-C60F support the COM Express type6 module Basic and Compact Sizes with ATX size(305x244mm) form factor. This carrier board passed the most of Portwell evaluation testing. These functions include but are not limited to a rich complement of high speed interfaces such as PCIe, USB4, SATA. And also support several legacy I/O such as UART, GPIO, SMBUS, I2 C.

SMARC 2.2 Compliant module (82 x 50 mm) powered by Intel^® Alder Lake-N, Amston Lake (Atom^® x7000RE), and Twin Lake (Core Processor N) Series SoCs, featuring onboard LPDDR5 SDRAM

220W DC/DC 9-36V input/ATX output Board type Converter

Intel^® Wildcat Lake; LPDDR5, UFS 3.1; dual HDMI^®/eDP; 2.5GbE; USB 3.2, USB 2.0; M.2 E-Key; TPM, GPIO, I2C/SMBus, Smart FAN

PNAC-31110 builds on Intel^® Denverton C3758R 1U rackmount system with up to 8x ETH ports , 1x Proprietary ETSFF OCP NIC 3.0 Slot.

Portwell Proprietary ETSFF PoE+ Switch Expansion Card for OCP NIC 3.0

1 U Rackmount System with Intel^® Amston Lake x7809C(8C) Processor for SD-WAN solution

NVIDIA Jetson Orin AI module; 2x 2.5GbE RJ45 with PoE+; 1x M.2 Key-M 2242/60 (PCIe x4); OCP design based