Embedded Edge Control Platform for Maritime Autonomy
Discover Portwell’s embedded edge control platforms. Our SMARC modules deliver scalable, low-power computing for maritime autonomy, USVs, and MASS operations.
July 22, 2026
Portwell provides high-reliability defense embedded computing solution designs and aerospace embedded systems through Design and Manufacturing Services (DMS). In addition, we deliver scalable hardware tailored for mission-critical aerospace and defense systems.
Additionally, our scalable computer-on-module platforms support sensor processing, mission communications, and embedded control. As a result, they deliver reliable performance across airborne, land, and maritime environments.
Multi-source sensor integration, signal and image processing, and mission data handling
High-speed networking, data routing, and system communication
Mission-specific I/O, device connectivity, and carrier board integration
Compact, long-life onboard computing for unmanned and maritime systems
Scalable platforms for computing performance, I/O expansion, power, thermal requirements, and future platform migration.
We customize carrier boards to integrate application-specific I/O, connectors, and power systems efficiently.
BIOS, firmware, embedded controller configuration, and system-level integration support based on project requirements.
Long-life availability, BOM control, and EOL planning reduce redesign and requalification efforts.
Engineered for mission-critical reliability, Portwell’s embedded computing platforms integrate rugged design enhancements. As a result, they help system integrators meet challenging environmental requirements and streamline system-level compliance based on MIL-STD specifications and standards:
Wide Operating Temperature (-40°C to 85°C): Industrial-grade component selection ensures stable continuous operation across extreme high- and low-temperature environments. (Featured models: PCOM-B705GT, PCOM-B65F)
Anti-Vibration Onboard Memory Design: Soldered memory configurations eliminate socket-related connection risks under severe shock and high-vibration conditions. (Featured models: PCOM-BC00, PCOM-BA03)
Optional Conformal Coating: Protective PCB coating shields electronic components against moisture, humidity, dust, and environmental corrosion.
Dedicated Thermal Heat Spreader Solutions: Standardized conduction-cooling interfaces enable efficient heat dissipation within sealed, fanless chassis designs. (Featured COM Express modules: PCOM-B707GT, PCOM-B65A)
Discover Portwell’s embedded edge control platforms. Our SMARC modules deliver scalable, low-power computing for maritime autonomy, USVs, and MASS operations.
Find out how COM Express Type 7 drives high-performance systems for comprehensive anti-drone solutions in extreme environments.
Explore high-performance UAV computing systems powered by COM Express modules. Learn how our rugged Type 6, 7, and 10 architectures deliver scalable edge computing and reliable performance for airborne AI processing and ground control stations.
Explore Portwell’s full line of industrial computer-on-modules engineered to strict PICMG standards. Specifically, from high-speed COM Express Type 6 and Type 7 to compact Type 10 and SMARC modules, our modular platforms deliver scalable processing power, low-latency connectivity, and long-term availability for demanding defense and aerospace applications.
Intel®New Gen Core™ ultra; 2x DDR5 SO-DIMM to 128GB IBECC; 20 PCIe Gen4 lanes; 4x USB 3.2 Gen2; 2x DDI, eDP
COM Express Type 6 Compact Size Module with AMD Ryzen™ Embedded 8000 Processor, DDR5 SO-DIMM, DDI, eDP, LVDS, VGA, PCIe Gen 4, USB 3.2 Gen2, discrete TPM 2.0, SATA, Out-of-Band (OOB) Management
Intel®PTL-H; 4P+8E+4LPE; 12Xe GPU (120 TOPS), NPU 5 (50 TOPS); 2x DDR5 SO-DIMM to 128GB IBECC; 12 PCIe Gen4 lanes; USB3.2, SATA, DDI, eDP/LVDS; MIPI-CSI
COM Express Type 6 Basic size module with Intel®New Gen Core Ultra 200 Series Processor DDR5 SO-DIMM, DDI, PCIe Gen 4,USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type6 Basic size module with Intel®13th Gen H Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen2, 2.5Gb Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type-VI Basic module with Intel®11th Gen H Processor with DDR4 SO-DIMM, DDI, PCIe Gen 4.0, USB 3.2 Gen2x1, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP/LVDS, SATA III and VGA
COM Express Type 7 Basic Module based on Intel®Xeon® D-1800 Processors with Two Channels and Two SO-DIMM slots.
COM-Express® Type 7 Basic module with AMD® Embedded RyzenTM V3000 CPU Family equipped on-module NVME SSD
COM Express Type 7 Basic Module based on Intel®Xeon® D-1700 Processors with Three Channels and Four SO-DIMM slots
SMARC 2.2 Compliant module (82 x 50 mm) powered by Intel®Alder Lake-N, Amston Lake (Atom® x7000RE), and Twin Lake (Core Processor N) Series SoCs, featuring onboard LPDDR5 SDRAM
Intel Atom® x7000 series SoC based on Type 10 mini
COM-Express® module with LPDDR5 SDRAM
ATX COM Express Type 6 carrier board featuring USB4, PCIe Gen4, and -40°C to 85°C wide-temp support.
Micro-ATX Form Factor Evaluation Carrier Board For Type 10 COM Express@ Rev 3.0 Module
Portwell’s DMS (Design & Manufacturing Services) optimizes precision engineering and innovative design. We transform concepts into leading-edge products with a meticulous approach to customization, ensuring excellence from blueprint to execution. Partner with us to shape the future of industrial technology.
