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COM Express ®

Standardized Computer-on-Module Platform

COM Express® defines standardized form factors and pinouts for Computer-on-Modules. Each module integrates core computing functions such as the processor, memory, graphics, storage interfaces, and high-speed connectivity, while a carrier board provides application-specific I/O and system expansion.

COM Express is available in three standardized form factors:

  • Mini: 84 × 55 mm
  • Compact: 95 × 95 mm
  • Basic: 125 × 95 mm
Intel Atom® Elkhart Lake series SoC based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket
Intel Atom® E3800 series SoC based on Type 10 Mini COM-Express® module with DDR3L SDRAM, NANDrive and USB 3.0
Intel Atom® E3900 series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM, eMMC and USB 3.0
Intel Atom® Apollo Lake series SoC based on Type 6 Compact COM-Express® module with 2x DDR3L SD-DIMM Socket
Intel®Tiger Lake-UP3 Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0, and USB 3.2
Intel®Comet Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, VGA, Gigabit Ethernet, SATA III, and USB 3.2 Gen2
Intel®Coffee Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, Gigabit Ethernet, SATA III, and USB 3.2 Gen2
Intel®Core™ Whiskey Lake-U i7/i5/i3 series processor based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket
Intel®Xeon® D-1600 series SoC based on Type 7 Basic COM-Express® module
Intel Atom® C3000/C3000-Refresh series SoC based on Type 7 Basic COM-Express® module with 3x DDR4 ECC SO-DIMM Socket
Mini-ITX Form Factor Evaluation Carrier Board for Type 6 Com-Express® Rev 2.1 Module
PCOM-C615 is PICMG 1.3 Full Size Form Factor Evaluation Carrier Board for COM Express® Revision 2.0 Type VI Module. PCOM-C615 follows standard PICMG 1.3 golden finger pin definition and let customer save system total cost for easily upgrading modules

ATX Form Factor Evaluation Carrier Board for Type 6 Com-Express® Rev 3.0 Module

ATX Form Factor Evaluation Carrier Board for COM Express Revision 3.0 Type VII Module with 4x 10GbE Support with Inphi CS4227 PHY
Intel®Core™ Kaby Lake-U/Skylake-U i7/i5/i3 series processor based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket
Intel Atom®TM N3000 series based TypeVI COM Express with DDR3L SDRAM, VGA, LVDS, USB 3.0, PCIE and surround design.Intel Atom®TM N3000 series based TypeVI COM Express with DDR3L SDRAM, VGA, LVDS, USB 3.0, PCIE and surround design.

Flexible and Scalable Embedded Computing

By separating the computing module from the carrier board, COM Express enables developers to reuse validated carrier designs across different processor platforms and product generations. This modular approach helps shorten development cycles, simplify system upgrades, and extend product lifecycles.

Portwell COM Express Solutions

Portwell offers COM Express Type 6, Type 7, and Type 10 modules, along with evaluation and application-ready carrier boards. Depending on the selected model, available features may include Intel®or AMD processors, DDR5 memory, PCI Express, USB, SATA, multiple display interfaces, high-speed Ethernet, TPM 2.0, and embedded AI acceleration.

Portwell COM Express solutions are suitable for industrial automation, machine vision, edge AI, medical equipment, transportation, networking, and other embedded applications requiring scalable performance and long-term availability.